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1 video camera lsi publication date: april 2003 sdb00054cem MN31121SA ccd image sensor vertical driver ic overview the MN31121SA is a 2d interline ccd image sensor vertical driver ic that integrates four vertical driver chan- nels and one sub drive channel on a single chip. this ic can reduce power consumption and the number of exter- nal parts. the MN31121SA consists of a vertical driver block that includes both level shifter circuits and 2-value and 3-value output driver circuits, and a sub driver block that includes level shifter and 2-value output driver circuits. features ? level shifter circuits input (v dc , ground) output (v hh , v l ) ? 2-value output driver circuits (vertical driver block) outputs: v m24 and v l ? 3-value output driver circuits (vertical driver block) outputs: v h , v m13 , and v l ? 2-value output driver circuits (sub driver block) outputs: v hh and v l applications ? video cameras, surveillance cameras, digital still cam- eras, ccd camera systems (top view) 1 2 3 4 5 6 7 8 9 10 o sub v l o v2 v m13 o v1 v dc i v1 ch1 i v2 i sub 20 19 18 17 16 15 14 13 12 11 v hh v m24 o v4 o v3 v h n.c. i v3 ch2 i v4 n.c.
MN31121SA 2 sdb00054cem block diagram 1 2 3 4 5 6 7 8 9 10 o sub v l o v2 v m13 o v1 v dc i v1 ch1 i v2 i sub 20 19 18 17 16 15 14 13 12 11 v hh v m24 o v4 o v3 v h n.c. i v3 ch2 i v4 n.c. 3-value driver level shifter 3-value driver level shifter level shifter level shifter level shifter level shifter level shifter note) v dc , v l : common power supply v m13 , v m24 : vertical driver block 2-value and 3-value independent power supply v hh , v h : sub driver block and vertical driver block 3-value independent power supply
MN31121SA 3 sdb00054cem pin descriptions pin no. pin name i/o description 1o sub o sub pulse output 2v l i low-level power supply 3o v2 o 2-value transfer pulse output 4v m13 i mid-level power supply 5o v1 o 3-value transfer pulse output 6v dc i input block high-level power supply 7i v1 i transfer pulse input 8 ch1 i charge pulse input 9i v2 i transfer pulse input 10 i sub i sub pulse input 11 n.c. ? unused 12 i v4 i transfer pulse input 13 ch2 i charge pulse input 14 i v3 i transfer pulse input 15 n.c. ? unused 16 v h i high-level power supply of vertical driver block 17 o v3 o 3-value transfer pulse output 18 o v4 o 2-value transfer pulse output 19 v m24 i mid-level power supply 20 v hh i high-level power supply of sub driver block electrical characteristics 1. absolute maximum ratings parameter symbol rating unit supply voltage 1 v hh -v l 32 v supply voltage 2 v h -v l 30 v supply voltage 3 v m13 , v m24 v l to 6 v supply voltage 4 v dc 0 to 7 v negative supply voltage v l ? 12 to 0 v input voltage v i v l ? 0.3 to v dc + 0.3 v input and output clamp diode currents i ic , i oc 10 ma maximum dc load current i odc 3ma maximum load capacitance c l 5 500 pf/pin power dissipation p d 180 mw operating temperature t opr ? 10 to + 70 c storage temperature t stg ? 50 to + 125 c note) the absolute maximum ratings are stress ratings only, and do not guarantee operation. stress in excess of the maximum rati ng may destroy the device.
MN31121SA 4 sdb00054cem electrical characteristics (continued) 2. operating conditions at t a = ? 10 c to + 70 c parameter symbol conditions min typ max unit supply voltage 1 v hh -v l v h -v l ? 30.5 v supply voltage 2 v h -v l 17 ? 28 v supply voltage 3 v m13 , v m24 ? 1 ? 4v supply voltage 4 v hh -v m13 12 ?? v v hh -v m24 supply voltage 5 v dc 2.5 ? 3.6 v negative supply voltage v l ? 10 ?? 4v input frequency f in ?? 20 khz 3. dc characteristics at v hh = 18.0 v, v h = 13.0 v, v m13 = v m24 = 1.0 v, v l = ? 7.0 v, v dc = 3.00 v, t a = ? 10 c to + 70 c parameter symbol conditions min typ max unit quiescent supply current i ddst v i = gnd, v dc = 2.6 v ?? 2ma v i = gnd, v dc = 3.0 v ?? 5 operating supply current i dddyn refer to test conditions ?? 7ma (input pulse timing, output load circuit) v i = gnd, v dc input pins i v1 , i v2 , i v3 , i v4 , ch1, ch2, i sub high-level voltage v ih v dc = 2.6 v 1.75 ? v dc v low-level voltage v il 0.0 ? 0.15 v high-level voltage v ih v dc = 3.0 v 2.5 ? v dc v low-level voltage v il 0.0 ? 0.3 v input leakage current i ilk v i = 0 v to v dc ? 1.0 ?+ 1.0 a output pins 1 (2-value outputs) o v2 , o v4 mid-level output voltage v om1 i om1 = ? 1 ma 0.9 ? v m24 v low-level output voltage v ol1 i ol1 = 1 ma v l ?? 6.9 v output on resistance (mid level) r onm1 i om1 = ? 50 ma ?? 60 ? output on resistance (low level) r onl1 i ol1 = 50 ma ?? 40 ? output pins 2 (3-value outputs) o v1 , o v3 high-level output voltage v oh2 i oh2 = ? 1 ma 12.9 ? v h v mid-level output voltage v om2 i om2 = ? 1 ma 0.9 ? v m13 v low-level output voltage v ol2 i ol2 = 1 ma v l ?? 6.9 v output on resistance (high level) r onh2 i oh2 = ? 50 ma ?? 70 ? output on resistance (mid level) r onm2 i om2 = 50 ma ?? 60 ? output on resistance (low level) r onl2 i ol2 = 50 ma ?? 60 ? output pins 3 (sub outputs) o sub high-level output voltage v ohh3 i ohh3 = ? 1 ma 17.9 ? v hh v low-level output voltage v ol3 i ol3 = 1 ma v l ?? 6.9 v
MN31121SA 5 sdb00054cem electrical characteristics (continued) 4. ac characteristics at v hh = 18.0 v, v h = 13.0 v, v m13 = v m24 = 1.0 v, v l = ? 7.0 v, v dc = 3.00 v, t a = ? 10 c to + 70 c parameter symbol conditions min typ max unit output pins 1 (2-value outputs) o v2 , o v4 propagation delay time t plm no load, ? 150 250 ns t pml low level to mid level rise time t tlm refer to test conditions ? 300 400 ns fall time t tml (output load circuit) output pins 2 (3-value outputs) o v1 , o v3 propagation delay time t plm no load, ? 150 250 ns t pml low level to mid level propagation delay time t pmh no load, ? 200 400 ns t phm mid level to high level rise time t tlm refer to test conditions ? 300 400 ns fall time t tml (output load circuit) rise time t tmh refer to test conditions ? 350 550 ns fall time t thm (output load circuit) output pins 3 (sub output) o sub propagation delay time t plhh no load, ? 150 250 ns t phhl low level to high level rise time t tlhh refer to test conditions ? 300 400 ns fall time t thhl (output load circuit) test conditions 1. output load circuit o v1 1 000 pf 1 500 pf 800 pf 500 pf 500 pf 800 pf 1 500 pf 1 000 pf o v2 o sub o v4 o v3 2 700 pf 3. dc characteristics (continued) at v hh = 18.0 v, v h = 13.0 v, v m13 = v m24 = 1.0 v, v l = ? 7.0 v, v dc = 3.00 v, t a = ? 10 c to + 70 c parameter symbol conditions min typ max unit output pins 3 (sub outputs) (continued) o sub output on resistance (high level) r onhh3 i onhh3 = ? 50 ma ?? 60 ? output on resistance (low level) r onl3 i onl3 = 50 ma ?? 50 ?
MN31121SA 6 sdb00054cem test conditions (continued) 2. input pulse timing charts (ntsc) i v1 i v2 i v3 i v4 i sub 1 cycle 60 hz ch1 ch2 2 s 63.5 s 508 s 63.5 s 15 s function tables 1. 2-value transfer pulse (vertical driver block) i v2 o v2 i v4 o v4 high low low mid 2. 3-value transfer pulse ch1 i v1 o v1 ch2 i v3 o v3 high high low low mid low high low low high note) i v1 , i v2 , i v3 , i v4 , ch1, ch2 high: v dc , low: ground o v1 , o v2 , o v3 , o v4 high: v h , mid: v m13 or v m24 , low: v l
MN31121SA 7 sdb00054cem timing charts i v2 1. 2-value transfer pulse 2. 2-value transfer pulse o v2 i v4 o v4 2 s 63.5 s 508 s 63.5 s high low mid low high low mid low 3. 3-value transfer pulse 4. 3-value transfer pulse high low high i v3 o v3 high low mid low o v1 mid low i v1 ch1 high low high ch2 high low 15 s function tables (continued) 3. unnecessary charge sweep-out pulse (sub driver block) i sub o sub high low low high note) i sub high: v dc , low: ground o sub high: v hh , low: v l
MN31121SA 8 sdb00054cem usage notes 1. if the sub driver is not used: 1) connect v hh (pin 20) to v h (pin 16). 2) connect i sub (pin 10) to v dc (pin 6). 3) leave o sub (pin 1) open. 2. mount the bypass capacitors for power supply pins v hh (pin 20), v h (pin 16), v m13 (pin 4), v m24 (pin 19), v l (pin 2), and v dc (pin 6) as close as possible to the pin itself. 3. if the overcurrents that occur at power on and power off are limited to under 10 ms and under 100 ma, then the MN31121SA is guaranteed for 10,000 power cycle (power on/power off) operations. 4. guarantee period after packing is opened the guarantee period after opening the moisture-proof packing is three weeks under environmental conditions of 30 c and 70% rh. 5. the recommended reflow soldering temperature is 230 c. timing charts (continued) 5. sub pulse i sub o sub high low high low
MN31121SA 9 sdb00054cem application circuit example 3 2 14 12 10 8 6 ccd drive logic mn6732741 768h ccd image sensor mn39143ft/39243ft v3 v4 ch1 ch2 sub v1 v2 v3 v4 sub 12 13 14 15 10 v1 v2 o sub v l o v2 v m13 o v1 v dc i v1 ch1 i v2 i sub 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 v hh v m24 o v4 o v3 v h n.c. i v3 ch2 i v4 n.c. v hh v l v m13 v dc v m24 v h 3-value driver level shifter 3-value driver level shifter level shifter level shifter level shifter level shifter level shifter 1 m ? 2 200pf 47 k ? 3.3 f/50 v 3.3 f/5 v 200 k ? + 16 v note) mount the bypass capacitors for the MN31121SA power supply pins (v hh , v h , v m13 , v m24 , v l , and v dc ) as close as possible to the pin itself.
MN31121SA 10 sdb00054cem package dimensions (unit: mm) ? ssop020-p-0225 110 20 6.50 0.20 1.00 0.20 0.30 min. (0.33) 0.25 0.10 4.30 0.20 1.50 0.20 1.90 max. 0.10 0.10 6.30 0.30 11 seating plane seating plane 0.65 0.13 m 0.15 +0.10 ?0.05 0 to 8 0.10 new package dimensions (unit: mm) ? ssop020-p-0225c (lead-free package) 4.30 0.20 6.30 0.30 1.50 0.10 0.10 0.10 6.50 0.20 0.25 0.10 1.00 0.20 0.65 0.15 +0.10 - 0.05 0 to 8 11 10 20 1 0.30 min. m 0.13 1.80 max. seating plane seating plane (0.325) 0.10 note) the package of this product will be changed to the following lead-free type (ssop020-p-0225c).
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul

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